Ultra High Vacuum Degassing Chamber

 1. Semiconductor & Quantum Device Fabrication

Wafer Processing: Removes hydrocarbons, moisture, and oxides from silicon wafers before epitaxial growth (e.g., GaN for power devices).

Quantum Computing Hardware: Eliminates surface contaminants on qubit chips (superconducting circuits/spin qubits) to prevent decoherence.

EUV Lithography Optics: Degasses multilayer mirrors to maintain reflectivity (>95%) by preventing carbon contamination.

2. Surface Science & Advanced Research

Scanning Probe Microscopy (STM/AFM): Prepares atomically clean surfaces (e.g., graphene, topological insulators) for defect-free imaging.

Molecular Beam Epitaxy (MBE): Conditions substrates (e.g., GaAs, SiC) to achieve monolayer-precision crystal growth.

Synchrotron/X-ray Experiments: Ensures sample chambers are contaminant-free to avoid beamline scattering artifacts.

3. Nuclear Fusion & Particle Physics

Tokamak Plasma Vessels: Reduces hydrogen outgassing from plasma-facing components (e.g., tungsten tiles) to stabilize fusion reactions.

Particle Accelerators: Degasses beam tubes and superconducting RF cavities to prevent electron cloud instability (e.g., in LHC/CERN).
4. Aerospace & Spacecraft Components

Optical Systems: Removes silicones/organics from telescope mirrors (e.g., James Webb) to prevent cryo-contamination.

Satellite Thruster Systems: Conditions electric propulsion components (ion thrusters) to avoid thruster poisoning.
Technical Workflow & Key Features

UHV chambers use specialized materials (stainless steel 316L, copper gaskets) and pumps (turbomolecular + ion pumps) to maintain vacuum integrity.

Critical Performance Metrics

Base Pressure: ≤5×10^-10 torr (after bakeout)

Outgassing Rate: <10^-12 torr·L/s·cm² (for chamber walls)

Temperature Uniformity: ±2°C across the sample (for thermal processing)

Failure Risks in UHV-Sensitive Systems

Emerging Applications

Quantum Sensors: Degassing MEMS gravimeters/gyroscopes to reduce noise.

2D Material Synthesis: Preparing contamination-free substrates for MoS₂/WSe₂ growth.

Nuclear Isotope Production: Purifying targets for medical radioisotopes (e.g., ⁹⁹Mo).

Conclusion: UHV Degassing Chambers are foundational for atomic-scale manufacturing and extreme-environment systems. Unlike ASTM E595 chambers (which test material outgassing), UHV chambers actively eliminate contaminants to enable breakthroughs in quantum tech, fusion energy, and nanotechnology. For operational protocols, refer to standards like ISO 14644-7 (cleanroom compatibility) or SEMI F73 (semiconductor tool requirements).

It is a key step to improve the comprehensive capability of the discharge cavity. The amount of Desorption gas in the use of relevant parts directly affects the quality of discharge capacity, so it is necessary to establish a continuous vacuum baking degassing platform. This is mainly divided into the whole cavity baking degassing platform and parts baking degassing platform. Through the establishment of the platform, in the early stage of using the discharge chamber, a reasonable baking degassing process is established to remove the residual impurity gas and minimize the influencing factors that may affect the discharge capacity of the discharge chamber. In order to meet the above conditions, In this paper, the outline of vacuum baking platform, vacuum system, control system, heating system, special interface, other properties of the whole machine are reviewed, aiming to establish a complete vacuum baking degassing platform with full use requirements.

Diagnostics System for Plasma Characterization: Capable of providing detailed analysis of plasma parameters such as density, temperature, and potential. Tools shall include, but not limited to, Langmuir probes, Faraday cups, Residual Gas Analyzers RGA300, and Electromagnetic Spectrum Analyzer.

Cylindrical Technical Parameters:

Box Type Technical Parameters: