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Quantum Precision Ultra-High Vacuum (UHV) Systems
  • Quantum Precision Ultra-High Vacuum (UHV) Systems
Quantum Precision Ultra-High Vacuum (UHV) Systems

Quantum Precision Ultra-High Vacuum (UHV) Systems

"Quantum Precision Ultra-High Vacuum System" refers to a complete set of equipment specifically designed and engineered for quantum precision measurement experiments, capable of achieving and maintaining an ultra-high vacuum environment. It serves as indispensable infrastructure for modern frontier physics research (e.g., cold atom physics, quantum optics, quantum computing, precision metrology).

Product Details

I. Core Applications 


Cold Atom Physics Experiments

Atomic Clocks: Optical lattice clocks (Sr, Yb), ion trap clocks (Al⁺, Yb⁺)

Atom Interferometers: Gravitational gradient mapping (geophysical prospecting), inertial navigation (submarines, spacecraft)

Bose-Einstein Condensates (BEC): Quantum simulation, topological quantum state research 


Quantum Computing & Information

Trapped-Ion Quantum Computers: Qubit manipulation (requires vacuum >10⁻¹¹ mbar)

Neutral-Atom Quantum Computing: Atom qubits in optical tweezer arrays (vacuum >10⁻¹⁰ mbar) 


Quantum Sensing & Precision Metrology

NV-Diamond Magnetometers: Nanoscale magnetic field imaging (biomolecules, material defects)

Cold-Atom Magnetometers: Dark matter detection, cosmological constant variation studies

Quantum Gravimeters: Mineral exploration, earthquake (sensitivity: 10⁻⁹ *g*) 


Fundamental Physics Research

Testing fundamental constants (e.g., fine-structure constant α)Probing quantum gravity effectsSymmetry violation experiments (e.g., electron electric dipole moment)


II. Critical Performance Parameters

Parameter CategoryTypical Value/RequirementSignificance
Base Pressure<10-11 mbar (10-12 mbar for ion traps)Enables long coherence times (>1 s)
Gas Load<10-12 mbar·L/s (leak rate)Maintains UHV stability
Residual Gas CompositionH2 <40%, H2O partial pressure <10-13 mbarMinimizes decoherence (H2O is key noise)
Magnetic NoiseStray field <1 μT, gradient <1 μT/mPrevents atomic energy level shifts
Vibration NoiseRMS displacement <10 nm @ 1–100 HzEnsures optical/particle stability
Bakeout Temperature150–250°C (48–72 hours)Removes adsorbed surface contaminants
Optical Window QualityWavefront distortion < λ/10 @ 633 nmGuarantees laser interferometry precision

III. Key System Design Elements

This complex integrated system comprises multiple critical subsystems working in synergy:


1. Vacuum Chamber

Materials:

Non-magnetic stainless steel (e.g., 316L) or aluminum alloy (e.g., 6061) to minimize magnetic interference (critical for cold-atom experiments).

Structure:

Compact and rigid design; internal geometry optimized for experimental optical paths (optical traps, probe lasers) and electrode configurations (ion traps).

Internal Surface Treatment:

Electropolishing: Standard process to reduce surface area, minimizing gas adsorption/desorption (Surface roughness: Ra <0.1 μm).

Gold Plating: Optional to enhance IR reflectivity or reduce contact potential.

Optical Viewports:

Multiple high-precision, low-stress viewports (typically fused quartz).

Sealed with knife-edge flanges (CF/FKF type) to ensure UHV integrity.

High transmission (>99% @ relevant wavelengths) and low wavefront distortion (<λ/10). 


2. Vacuum Generation System

Foreline Pumps:

Dry scroll pumps or diaphragm pumps (for rough vacuum: 105 → 10-2 mbar).

Main UHV Pumps (combined use for 10-9–10-12 mbar):

Ion Pumps: Oil-free, vibrationless; ionize gas molecules via strong EM fields (core pump).

Titanium Sublimation Pumps (TSP): Ti vapor chemically adsorbs reactive gases (N2, O2, H2, CO). Boosts pumping speed (especially for H2) when paired with ion pumps.

Cryopumps: Cryogenic surfaces (<20 K) physically adsorb all gases. High speed, non-selective. Requires periodic regeneration.

Non-Evaporable Getter (NEG) Pumps: e.g., Zr-V-Fe alloys; chemically adsorb gases after activation (compact/specialized use).

UHV Valves:Gate valves/angle valves to isolate zones, connect pumps, and control gas flow. 


3. Vacuum Measurement System

High-Vacuum Gauges:

Cold-cathode gauges (e.g., Penning gauges) for 10-2–10-9 mbar.

UHV Gauges:

Bayard-Alpert (BA) ionization gauges for 10-3–10-12 mbar (primary vacuum monitoring).

Residual Gas Analyzer (RGA):

Quadrupole mass spectrometer for residual gas composition analysis (identifies contaminants: H2O, hydrocarbons, H2). 


4. Bakeout System

High-temperature baking (150–250°C) of chambers/piping is essential for achieving UHV.

Accelerates desorption of adsorbed molecules (primarily H2O) from internal surfaces.

Requires electric heating tapes and precise temperature monitoring. 


5. Leak Detection

High-sensitivity helium mass spectrometer leak detectors ensure hermeticity.Micro-leaks (>10-12 mbar·L/s) prevent UHV attainment/maintenance. 


6. Gas Introduction System

UHV valves/tubing connect to ultra-pure gas sources (e.g., alkali metal dispensers, buffer gases, calibration gases).Requires precision pressure control (e.g., leak valves). 


7. Interfaces for Quantum Experiments

Precision mounts for:

Magneto-optical trap (MOT) coils

Ion trap electrodes

Optical components (lenses, mirrors, waveplates)

Laser input/detection optics

Electrical feedthroughs (HV, RF, DC)

Cryostat interfaces 


8.Vibration & Magnetic Shielding:

Vibration Isolation: Active platforms (0.5–100 Hz bandwidth, >40 dB attenuation); remote pump mounting with flexible bellows.

Magnetic Shielding: Multi-layer Mu-metal (initial permeability >40,000); active compensation coils (residual field <1 nT). 


9. Optical & Electrical Interfaces

Optical Viewports:

Material: Fused silica (CTE-matched to stainless steel).

Sealing: Conflat flanges with oxygen-free copper gaskets (e.g., CF35/CF63).

Electrical Feedthroughs:

RF: SMA/SSMP connectors (DC–40 GHz).

High-voltage: Ceramic insulation (withstand >10 kV). 

10. Control System

Integrated computer control for:

Real-time monitoring (pressure, pump status, temperature).

Automated valve operation, bakeout cycles, gas injection.

Data logging and remote access.


IV. Manufacturing Workflow

Key Processes & Techniques

StageCritical StepsTechnical Requirements
Material Prep1. Electropolishing
2. Stress-relief annealing
Reduce outgassing, remove magnetic impurities
Chamber Welding1. Argon-shielded TIG
2. Electron-beam welding
Helium leak rate <10-12 mbar·L/s
Surface Treatment1. Ultrasonic cleaning (acetone/ethanol)
2. Vacuum bakeout
Achieve ASTM Level 100 cleanliness
Leak TestingHelium mass spectrometry (<10-12 mbar·L/s sensitivity)Focus on welds/flange seals
Pump Integration1. Oil-free pump stacking
2. Vibration-damped mounting
Magnetic-bearing turbo pumps preferred
Bakeout DegassingRamped heating to 250°C (±2°C control)Monitor gas species via RGA
Validation1. Ultimate pressure test
2. Residual gas analysis
3. Magnetic shielding verification
72-hour stability certification required

Special Process Challenges

Non-magnetic Compliance:

Titanium/ceramic tools mandatory to avoid Fe contamination

Assembly in Mu-metal-shielded environments 

Particulate Control:

ISO Class 4 cleanroom (≤352 particles/m3 for ≥0.5 μm)

Continuous N2 purge during assembly 


V. Emerging Technologies

Integrated UHV Systems:

Chip-scale ion traps with monolithic vacuum cavities (UHV-CMOS processes)

Microfabricated Ti-sublimation pumps (<10 cm3 volume) 

AI-Driven Monitoring:

Predictive maintenance via residual gas analytics

Digital twin-assisted bakeout optimization 

Advanced Pumping:

Non-Evaporable Getter (NEG) coatings (10× higher pumping speed)

Hybrid cryo-ion pump modules


Summary

In essence, the Quantum Precision Ultra-High Vacuum System represents a sophisticated engineering feat designed to create and sustain an environment of extreme purity (molecular-level cleanliness), exceptional quietness (near-zero vibration/magnetic noise), and ultra-low thermal interference for highly sensitive quantum experiments. It transcends merely providing a low-pressure background; instead, it serves as the fundamental material foundation essential for achieving the long coherence times, high signal-to-noise ratios, and ultra-high precision demanded by quantum metrology.

The design, fabrication, installation, and maintenance of such systems involve significant technical barriers, making them signature infrastructure in modern quantum technology frontier laboratories.

Key Nuances Captured:

Ultra-Clean → "Extreme purity (molecular-level cleanliness)"

(Emphasizes absence of contaminants at atomic/molecular scale)

Ultra-Quiet→ "Exceptional quietness (near-zero vibration/magnetic noise)"

(Specifies suppression of both acoustic and electromagnetic interference)

Ultra-Cold → "Ultra-low thermal interference"

(Highlights thermal management without limiting to cryogenic temps)

Fundamental material foundation

(Accurately conveys its role as a physical enabler)

Significant technical barriers

(Reflects multidisciplinary engineering challenges)

Signature infrastructure

(Denotes indispensable, identity-defining equipment)

Sophisticated engineering feat

(Avoids over-poetic "masterpiece" while honoring complexity)

Quantum precision 

UHV systems represent cutting-edge multidisciplinary engineering, demanding concurrent optimization of:

Extreme vacuum (<10-11 mbar)

Sub-nanometer vibration stability

Near-zero magnetic noise (<1 nT)

Molecular-level cleanliness

Manufacturing requires rigorously controlled environments (non-magnetic + ultra-clean) and validation via helium leak testing, prolonged bakeouts, and residual gas analysis. As foundational platforms for quantum technologies, their performance directly dictates the feasibility of next-generation physics experiments.